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TMCnet Unified Communications Week in Review


December 10, 2011

With unified communications (UC) gaining momentum, it was not surprising to see a lot of news and development activity this week in this field. From TMC’s UC webinar announcement to Polycom’s launch of new room video collaboration solution interoperable with Microsoft Lync, the UC proponents were busy revealing new services.

To help clients build communities in print, in person and online, TMC announced a complimentary  webinar, “Justifying Unified Communications - - The Proof Cases for Why UC, Where and Why Now!” to be held on Thursday, December 15, 2011.

unified communications contributor Calvin Azuri reported that University of North Alabama has deployed ADTRAN's NetVanta UC solution to drive network migration from TDM to IP. According to ADTRAN, its NetVanta UC solution will support the campus-wide network migration at the University of North Alabama from TDM to IP. The open-architecture of the NetVanta UC solution made it possible for the Uuniversity to use its existing infrastructure to seamlessly migrate its network to advanced UC services and helped save both time and cost.

Another contributor Jyoti Shanbhag reported on Tango Networks new cloud based mobile UC service. The Abrazo cloud services suite of applications is backed by Tango Network’s unique federated architecture. As per this report, the new suite supports mobile application delivery from the network or cloud instead of on the devices themselves. The federated architecture allows for the partial or total delivery or all Abrazo Cloud Services and is designed to add new applications as they are developed.

Likewise, UC provider Polycom, Inc. unveiled Polycom SIP-based wired and wireless voice products that will now be interoperable with Microsoft Lync, wrote contributor Arvind Arora. In addition, the company also launched a new solution named Polycom CX7000, a room video collaboration solution that can also be integrated with Microsoft Lync.


Ashok Bindra is a veteran writer and editor with more than 25 years of editorial experience covering RF/wireless technologies, semiconductors and power electronics. To read more of his articles, please visit his columnist page.




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