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TMCNet:  Freescale Semiconductor Assigned Patent for Lead Frame for Assembling Semiconductor Device

[February 10, 2014]

Freescale Semiconductor Assigned Patent for Lead Frame for Assembling Semiconductor Device

(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Feb. 10 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,643,156) developed by ShunanQiu, Yingtan, China, ZhigangBai, Tianjin, China, and Haiyan Liu, Tianjin, China, for a "lead frame for assembling semiconductor device." The patent application was filed on Sept. 6, 2012 (13/605,990). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=3&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=109&f=G&l=50&co1=AND&d=PTXT&s1=20140204.PD.&s2=%28TX.ASST.%29&OS=ISD/02/04/2014+AND+AS/TX&RS=ISD/02/04/2014+AND+AS/TX Written by Balkishan Dalai; edited by Jaya Anand.


BD0210JA0210-977102 (c) 2014 Targeted News Service

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